Epoxy underfill chip Level Adhesives
Networker
Hui Zhou Shi, Guang Dong Sheng, China
My Networking Pitch
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. Https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/Industry Experience
- Audiologist
- Optometrists-Eye Doctor
- Tight Covers. Architectural Membranes
Personal Interests
- Artificial Intelligence